• Reflow oven Etna B221-AC533

    Reflow oven Etna B221-AC533

    This conveyor reflow oven is intended for the PCBs soldering in the air environment. The oven can be use as inline system or in stand alone mode.

    функция soldering
  • Automatic reflow oven Etna B221-AC421

    Automatic reflow oven Etna B221-AC421

    This oven is mainly intended for small  and medium productions of electronics. The system can be integrated into the technological line or work as stand alone unit.
    The main advantages of the oven are: stability of soldering process, reliability and durability of all electronic and mechanical units, and also the minimum time for carrying out preventive maintenance.

    функция soldering
  • Batch reflow oven Etna B211-AC311

    Batch reflow oven Etna B211-AC311

    This compact oven is intended for the PCBs soldering in the hot air environment. The soldering temperature in the process camera and also other parameters are preset by means of the operating computer.

    функция soldering
  • Tabletype Oven B22 «Etna» B221-AC11

    Tabletype Oven B22 «Etna» B221-AC11

    Tabletype Oven B22 «Etna» B221-AC11 is used in a single or small-scale production for the reflow process in air environment. The reflow process is carried out by forced convection with the integrated heater.

    функция soldering

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.