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    [NAME] => Automatic reflow oven Etna B221-AC421 
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    [PREVIEW_TEXT] => This oven is mainly intended for small  and medium productions of electronics. The system can be integrated into the technological line or work as stand alone unit.
The main advantages of the oven are: stability of soldering process, reliability and durability of all electronic and mechanical units, and also the minimum time for carrying out preventive maintenance.
[~PREVIEW_TEXT] => This oven is mainly intended for small and medium productions of electronics. The system can be integrated into the technological line or work as stand alone unit. The main advantages of the oven are: stability of soldering process, reliability and durability of all electronic and mechanical units, and also the minimum time for carrying out preventive maintenance. [PREVIEW_TEXT_TYPE] => text [~PREVIEW_TEXT_TYPE] => text [DETAIL_TEXT] =>

This oven is mainly intended for small and medium productions of electronics. The system can be integrated into the technological line or work as stand alone unit.

The main advantages of the oven are: stability of soldering process, reliability and durability of all electronic and mechanical units, and also the minimum time for carrying out preventive maintenance.

Digits "421" in the name of this model mean the following:

- 4 preheating zones

- 2 peak heating zones

- 1 cooling zone

One of the oven’s features is the patented nozzles design. This design provides the qualitative soldering of components regardless of their form and the size. Uniform and "soft" hot air or nitrogen flow directed on the both PCB sides. Preheating and peak zones are equipped with a special modules with powerful fans and heaters located symmetrically each to other from top and bottom of the oven’s conveyor.

Temperature in each heating zone is set and controlled individually. Control over internal temperature is executed by means of special sensors (thermocouples) located in each heating zone. Thanks to thermocouples located at the conveyor level, obtaining almost real values of PCB soldering temperature is possible.

In case of excess of the preset temperature threshold in any zone, the control system carries out automatic adjustment of a temperature profile. This adjustment is carried out by means of the frequency converter. Individual automatic adjustment of heating elements temperature is also executed.

The oven’s conveyor drive equipped with DC motor. The needed speed of the conveyor is preset and controlled by means of the computer. The real and preset speeds are displayed on the PC monitor. Conveyor drive equipped with safety clutch to prevent chains blocking in the case of any failure, for example, PCB’s falling.

The central PCB support system prevents deformation of the wide and thin PCBs moving on the conveyor. The position of the central support is set by means of the computer and has 2 positions of height.

The automatic chains lubrication system allows considerably save lubricants and production time. This system also prolongs service life of the conveyor. The system can be activated automatically or in the manual mode. By means of the software the operator can preset duration and frequency of lubrication operation.

The software allows the operator to control temperature of heating and cooling modules, speed and width of the conveyor, quantity of PCBs in the process camera, position of the central PCB support and also to carry out the service settings. The user interface of the operating computer is convenient and simple. Information about all soldering parameters is displayed on the big touchscreen monitor (22 inches). Besides, visualization of PCBs transportation through the conveyor and the counter of PCBs is realized. In real time the operator can see, how many PCBs inside the oven and in what zones they are.

The modern oven’s design allows to carry out service and maintenance works in short terms. Purity of process camera is maintained thanks to automatic optimization of soldering processes by means of electronic monitoring systems, and also residues and evaporation removal system.

[~DETAIL_TEXT] =>

This oven is mainly intended for small and medium productions of electronics. The system can be integrated into the technological line or work as stand alone unit.

The main advantages of the oven are: stability of soldering process, reliability and durability of all electronic and mechanical units, and also the minimum time for carrying out preventive maintenance.

Digits "421" in the name of this model mean the following:

- 4 preheating zones

- 2 peak heating zones

- 1 cooling zone

One of the oven’s features is the patented nozzles design. This design provides the qualitative soldering of components regardless of their form and the size. Uniform and "soft" hot air or nitrogen flow directed on the both PCB sides. Preheating and peak zones are equipped with a special modules with powerful fans and heaters located symmetrically each to other from top and bottom of the oven’s conveyor.

Temperature in each heating zone is set and controlled individually. Control over internal temperature is executed by means of special sensors (thermocouples) located in each heating zone. Thanks to thermocouples located at the conveyor level, obtaining almost real values of PCB soldering temperature is possible.

In case of excess of the preset temperature threshold in any zone, the control system carries out automatic adjustment of a temperature profile. This adjustment is carried out by means of the frequency converter. Individual automatic adjustment of heating elements temperature is also executed.

The oven’s conveyor drive equipped with DC motor. The needed speed of the conveyor is preset and controlled by means of the computer. The real and preset speeds are displayed on the PC monitor. Conveyor drive equipped with safety clutch to prevent chains blocking in the case of any failure, for example, PCB’s falling.

The central PCB support system prevents deformation of the wide and thin PCBs moving on the conveyor. The position of the central support is set by means of the computer and has 2 positions of height.

The automatic chains lubrication system allows considerably save lubricants and production time. This system also prolongs service life of the conveyor. The system can be activated automatically or in the manual mode. By means of the software the operator can preset duration and frequency of lubrication operation.

The software allows the operator to control temperature of heating and cooling modules, speed and width of the conveyor, quantity of PCBs in the process camera, position of the central PCB support and also to carry out the service settings. The user interface of the operating computer is convenient and simple. Information about all soldering parameters is displayed on the big touchscreen monitor (22 inches). Besides, visualization of PCBs transportation through the conveyor and the counter of PCBs is realized. In real time the operator can see, how many PCBs inside the oven and in what zones they are.

The modern oven’s design allows to carry out service and maintenance works in short terms. Purity of process camera is maintained thanks to automatic optimization of soldering processes by means of electronic monitoring systems, and also residues and evaporation removal system.

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width="319" valign="top"> <p>Conveyor width </p> </td> <td width="319" valign="top"> <p>65-400 mm<strong> </strong></p> </td> </tr> <tr> <td width="319" valign="top"> <p>Conveyor speed </p> </td> <td width="319" valign="top"> <p>180-1800 mm/min<strong> </strong></p> </td> </tr> <tr> <td width="638" valign="top" colspan="3"> <p align="center"><strong>Zones parameters</strong></p> </td> </tr> <tr> <td width="319" valign="top"> <p>All heating zones length</p> </td> <td width="319" valign="top"> <p>2100 mm</p> </td> </tr> <tr> <td width="319" valign="top"> <p>Cooling zone length</p> </td> <td width="319" valign="top"> <p>700 mm</p> </td> </tr> <tr> <td width="638" valign="top" colspan="3"> <p><strong>Temperature parameters</strong></p> </td> </tr> <tr> <td width="319" valign="top"> <p>Max. preheating temperature</p> </td> <td width="319" valign="top"> <p>300°С </p> </td> </tr> <tr> <td width="319" valign="top"> <p>Max. peak temperature </p> </td> <td width="319" valign="top"> <p>350°С </p> 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The main parameters

Oven’s dimensions  (LхWхH) 

3590х1480х1738 mm (another on the request)

Weight

1800 kg

Power consumption

7.5 kW (working mode), , 40 kW (start mode)

Power supply

3 phases, 380 V, 50/60 Hz

Conveyor parameters

Conveyor width

65-400 mm

Conveyor speed

180-1800 mm/min

Zones parameters

All heating zones length

2100 mm

Cooling zone length

700 mm

Temperature parameters

Max. preheating temperature

300°С

Max. peak temperature

350°С

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<br /> </div> <div align="justify"> Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" ><img src="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" title="1" border="0" alt="1" width="300" height="400" /> <br /> </a> <br /> </div> </td></tr> <tr><td align="justify"> The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator; <br /> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" ><img src="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" title="2" border="0" alt="22.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> Control elements are included in animated graphic blocks with grouped in a logical way information; <br /> </div> <div align="justify"> Animated monitoring and control system allows to see all processes running inside the oven; <br /> </div> <div align="justify">For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" ><img src="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" title="3" border="0" alt="33.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields; <br /> </div> <div align="justify"> The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" ><img src="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" title="4" border="0" alt="44.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven; <br /> </div> <div align="justify"> There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week); <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" ><img src="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" title="5" border="0" alt="55.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify">Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long; <br /> </div> <div align="justify"> The automatic screen blocking function helps to avoid casual change of a profile or oven's setup; <br /> </div> <div align="justify"> Various settings of the oven are carried out also by means of the graphic interface. </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/30b/30b6b2cd1efe2120f9265bd2f2ad5ac8.jpg" ><img src="/upload/medialibrary/30b/30b6b2cd1efe2120f9265bd2f2ad5ac8.jpg" title="6" border="0" alt="6" width="300" /> <br /> </a> <br /> </div> </td></tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>
The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.
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The main parameters

Oven’s dimensions  (LхWхH) 

3590х1480х1738 mm (another on the request)

Weight

1800 kg

Power consumption

7.5 kW (working mode), , 40 kW (start mode)

Power supply

3 phases, 380 V, 50/60 Hz

Conveyor parameters

Conveyor width

65-400 mm

Conveyor speed

180-1800 mm/min

Zones parameters

All heating zones length

2100 mm

Cooling zone length

700 mm

Temperature parameters

Max. preheating temperature

300°С

Max. peak temperature

350°С

[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Технические данные [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>

The main parameters

Oven’s dimensions  (LхWхH) 

3590х1480х1738 mm (another on the request)

Weight

1800 kg

Power consumption

7.5 kW (working mode), , 40 kW (start mode)

Power supply

3 phases, 380 V, 50/60 Hz

Conveyor parameters

Conveyor width

65-400 mm

Conveyor speed

180-1800 mm/min

Zones parameters

All heating zones length

2100 mm

Cooling zone length

700 mm

Temperature parameters

Max. preheating temperature

300°С

Max. peak temperature

350°С

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2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Программа [ACTIVE] => Y [SORT] => 500 [CODE] => SOFT [DEFAULT_VALUE] => [PROPERTY_TYPE] => S [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => Y [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => HTML [USER_TYPE_SETTINGS] => Array ( [height] => 200 ) [HINT] => [PROPERTY_VALUE_ID] => 12047 [VALUE] => Array ( [TEXT] => <table class="soft"> <tbody> <tr><td> <div align="justify"> The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.); <br /> </div> <div align="justify"> Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" ><img src="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" title="1" border="0" alt="1" width="300" height="400" /> <br /> </a> <br /> </div> </td></tr> <tr><td align="justify"> The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator; <br /> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" ><img src="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" title="2" border="0" alt="22.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> Control elements are included in animated graphic blocks with grouped in a logical way information; <br /> </div> <div align="justify"> Animated monitoring and control system allows to see all processes running inside the oven; <br /> </div> <div align="justify">For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" ><img src="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" title="3" border="0" alt="33.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields; <br /> </div> <div align="justify"> The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" ><img src="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" title="4" border="0" alt="44.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven; <br /> </div> <div align="justify"> There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week); <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" ><img src="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" title="5" border="0" alt="55.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify">Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long; <br /> </div> <div align="justify"> The automatic screen blocking function helps to avoid casual change of a profile or oven's setup; <br /> </div> <div align="justify"> Various settings of the oven are carried out also by means of the graphic interface. </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/30b/30b6b2cd1efe2120f9265bd2f2ad5ac8.jpg" ><img src="/upload/medialibrary/30b/30b6b2cd1efe2120f9265bd2f2ad5ac8.jpg" title="6" border="0" alt="6" width="300" /> <br /> </a> <br /> </div> </td></tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>
The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.
[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Программа [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>
The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.
) ) [PRODUCT_PROPERTIES] => Array ( ) [PRODUCT_PROPERTIES_FILL] => Array ( ) [MORE_PHOTO] => Array ( ) [LINKED_ELEMENTS] => Array ( ) [SECTION] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 20.07.2016 12:22:41 [~TIMESTAMP_X] => 20.07.2016 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 06.07.2016 13:34:41 [~DATE_CREATE] => 06.07.2016 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. 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Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[~DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [~SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [CODE] => equipment [~CODE] => equipment [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/ [~SECTION_PAGE_URL] => /en/equipment/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [IPROPERTY_VALUES] => Array ( ) ) [1] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 2016-07-20 12:22:41 [~TIMESTAMP_X] => 2016-07-20 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2016-07-06 13:34:41 [~DATE_CREATE] => 2016-07-06 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. 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This oven is mainly intended for small and medium productions of electronics. The system can be integrated into the technological line or work as stand alone unit.

The main advantages of the oven are: stability of soldering process, reliability and durability of all electronic and mechanical units, and also the minimum time for carrying out preventive maintenance.

Digits "421" in the name of this model mean the following:

- 4 preheating zones

- 2 peak heating zones

- 1 cooling zone

One of the oven’s features is the patented nozzles design. This design provides the qualitative soldering of components regardless of their form and the size. Uniform and "soft" hot air or nitrogen flow directed on the both PCB sides. Preheating and peak zones are equipped with a special modules with powerful fans and heaters located symmetrically each to other from top and bottom of the oven’s conveyor.

Temperature in each heating zone is set and controlled individually. Control over internal temperature is executed by means of special sensors (thermocouples) located in each heating zone. Thanks to thermocouples located at the conveyor level, obtaining almost real values of PCB soldering temperature is possible.

In case of excess of the preset temperature threshold in any zone, the control system carries out automatic adjustment of a temperature profile. This adjustment is carried out by means of the frequency converter. Individual automatic adjustment of heating elements temperature is also executed.

The oven’s conveyor drive equipped with DC motor. The needed speed of the conveyor is preset and controlled by means of the computer. The real and preset speeds are displayed on the PC monitor. Conveyor drive equipped with safety clutch to prevent chains blocking in the case of any failure, for example, PCB’s falling.

The central PCB support system prevents deformation of the wide and thin PCBs moving on the conveyor. The position of the central support is set by means of the computer and has 2 positions of height.

The automatic chains lubrication system allows considerably save lubricants and production time. This system also prolongs service life of the conveyor. The system can be activated automatically or in the manual mode. By means of the software the operator can preset duration and frequency of lubrication operation.

The software allows the operator to control temperature of heating and cooling modules, speed and width of the conveyor, quantity of PCBs in the process camera, position of the central PCB support and also to carry out the service settings. The user interface of the operating computer is convenient and simple. Information about all soldering parameters is displayed on the big touchscreen monitor (22 inches). Besides, visualization of PCBs transportation through the conveyor and the counter of PCBs is realized. In real time the operator can see, how many PCBs inside the oven and in what zones they are.

The modern oven’s design allows to carry out service and maintenance works in short terms. Purity of process camera is maintained thanks to automatic optimization of soldering processes by means of electronic monitoring systems, and also residues and evaporation removal system.

The main parameters

Oven’s dimensions  (LхWхH) 

3590х1480х1738 mm (another on the request)

Weight

1800 kg

Power consumption

7.5 kW (working mode), , 40 kW (start mode)

Power supply

3 phases, 380 V, 50/60 Hz

Conveyor parameters

Conveyor width

65-400 mm

Conveyor speed

180-1800 mm/min

Zones parameters

All heating zones length

2100 mm

Cooling zone length

700 mm

Temperature parameters

Max. preheating temperature

300°С

Max. peak temperature

350°С

Adjustable central board supportThe option allows to transport big and thin PCBs without bending.

Automatic chain lubrication The option for automatic chains lubrication. Thanks to this system chains life time is increased significantly.

Conveyor speed controlСonveyor speed is adjustable and equipped with control system for constant monitoring.

Internal temperature monitoringEvery heating zone equipped with thermocouple for precise temperature measuring. Also there are thermocouples on the conveyor level.

SMEMA interfaceThe signal interface working under SMEMA protocol. The option is used for printer communication with the downstream line devices.

UPSThe option is necessary for power supply on PC, conveyor and cover of the process-chamber in the case of the main power breakage.

The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.

Recommend with this product