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    [NAME] => Batch reflow oven Etna B211-AC311
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    [PREVIEW_TEXT] => This compact oven is intended for the PCBs soldering in the hot air environment. The soldering temperature in the process camera and also other parameters are preset by means of the operating computer.
    [~PREVIEW_TEXT] => This compact oven is intended for the PCBs soldering in the hot air environment. The soldering temperature in the process camera and also other parameters are preset by means of the operating computer.
    [PREVIEW_TEXT_TYPE] => text
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    [DETAIL_TEXT] => 

This compact oven is intended for the PCBs soldering in the hot air environment. The soldering temperature in the process camera and also other parameters are preset by means of the operating computer. PCBs loading on the mesh conveyor of the oven is carried out manually. The oven’s process camera includes preheating zones, a peak zone and a cooling zone. PCBs unloading is also carried out manually.

Etna B211-AC311 is equipped with four heating zones:

- three preheating zones

- one peak zone

Hot air flow, in all heating zones organized from the top and the bottom sides. A special design of the nozzles allows to provide the qualitative soldering of electronic components regardless of their shape and the size. Process stability is maintained due to minimizing of mutual influence neighbouring heating zones to each other.

Control over a temperature profile in the process camera is executed by means of thermocouples individually for each zone. Automatic adjustment system provides accuracy of temperature profile in each heating zone. PCBs cooling is carried out in the active cooling zone.

In this model of the oven, the mesh belt conveyor allowing to make simultaneous loading of PCBs with different dimensions. It’s very important for prototype productions.

The digital speed regulator provides stable mesh belt moving regardless of temperature or load of the conveyor.

The oven’s control executed by means of modern computer supplied with the color touchscreen monitor (10"). The software with the multimedia interface allows execute oven’s control in the simple and convenient way. The basic version includes support of the Russian and English languages. The number of saved soldering programs is unlimited.

[~DETAIL_TEXT] =>

This compact oven is intended for the PCBs soldering in the hot air environment. The soldering temperature in the process camera and also other parameters are preset by means of the operating computer. PCBs loading on the mesh conveyor of the oven is carried out manually. The oven’s process camera includes preheating zones, a peak zone and a cooling zone. PCBs unloading is also carried out manually.

Etna B211-AC311 is equipped with four heating zones:

- three preheating zones

- one peak zone

Hot air flow, in all heating zones organized from the top and the bottom sides. A special design of the nozzles allows to provide the qualitative soldering of electronic components regardless of their shape and the size. Process stability is maintained due to minimizing of mutual influence neighbouring heating zones to each other.

Control over a temperature profile in the process camera is executed by means of thermocouples individually for each zone. Automatic adjustment system provides accuracy of temperature profile in each heating zone. PCBs cooling is carried out in the active cooling zone.

In this model of the oven, the mesh belt conveyor allowing to make simultaneous loading of PCBs with different dimensions. It’s very important for prototype productions.

The digital speed regulator provides stable mesh belt moving regardless of temperature or load of the conveyor.

The oven’s control executed by means of modern computer supplied with the color touchscreen monitor (10"). The software with the multimedia interface allows execute oven’s control in the simple and convenient way. The basic version includes support of the Russian and English languages. The number of saved soldering programs is unlimited.

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</td> <td width="243" valign="top"> <p align="center"> 1500 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Weight </p> </td> <td width="243" valign="top"> <p align="center"> 400 kg </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Floor load </p> </td> <td width="243" valign="top"> <p align="center"> 200 kg/m2 </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Process camera </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Length </p> </td> <td width="243" valign="top"> <p align="center"> 1454 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Preheating zones </p> </td> <td width="243" valign="top"> <p align="center"> 3 </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Preheating zones length </p> </td> <td width="243" valign="top"> <p align="center"> 1107 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Peak zone </p> </td> <td width="243" valign="top"> <p align="center"> 1 </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Peak zone length </p> </td> <td width="243" valign="top"> <p align="center"> 347 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> First zone max.temperature </p> </td> <td width="243" valign="top"> <p align="center"> 125°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Preheating zones max.temperature (except first) </p> </td> <td width="243" valign="top"> <p align="center"> 250°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Peak zone max.temperature </p> </td> <td width="243" valign="top"> <p align="center"> 290°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Soldering principle </p> </td> <td width="243" valign="top"> <p align="center"> Reflow </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Air circulation </p> </td> <td width="243" valign="top"> <p align="center"> 150 m3/h </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Heating up time<span dir="RTL"> </span> </p> </td> <td width="243" valign="top"> <p dir="RTL" align="center"> <span dir="LTR">Approx</span><span dir="LTR">. 45</span><span dir="LTR"> min</span><span dir="LTR"> </span> </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Temperature profile accuracy </p> </td> <td width="243" valign="top"> <p align="center"> +/-2К </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Cooling zone </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Length </p> </td> <td width="243" valign="top"> <p align="center"> 360 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Quantity </p> </td> <td width="243" valign="top"> <p align="center"> 1 </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Conveyor </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Width </p> </td> <td width="243" valign="top"> <p align="center"> 400 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Type </p> </td> <td width="243" valign="top"> <p align="center"> Mesh belt </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Clearance above conveyor </p> </td> <td width="243" valign="top"> <p align="center"> 30 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Conveyor speed </p> </td> <td width="243" valign="top"> <p align="center"> 300-1800 mm/мmin </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Speed accuracy </p> </td> <td width="243" valign="top"> <p align="center"> ≤ 30 mm/min </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Ambient conditions </p> </td> </tr> <tr> <td width="402" valign="top"> <p> External temperature </p> </td> <td width="243" valign="top"> <p align="center"> 15-32°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Humidity </p> </td> <td width="243" valign="top"> <p align="center"> 30-75% </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Electricity </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Power supply </p> </td> <td width="243" valign="top"> <p> 3х400 V +/-5% 50 Hz </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Cable </p> </td> <td width="243" valign="top"> <p> 5 wires (3 phases, N, ground) </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Starting power </p> </td> <td width="243" valign="top"> <p align="center"> 10 kW </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Working power </p> </td> <td width="243" valign="top"> <p align="center"> 2,5 kW </p> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

Dimensions, weight

Length

2340 mm

Width

870 mm

Height

1500 mm

Weight

400 kg

Floor load

200 kg/m2

Process camera

Length

1454 mm

Preheating zones

3

Preheating zones length

1107 mm

Peak zone

1

Peak zone length

347 mm

First zone max.temperature

125°С

Preheating zones max.temperature (except first)

250°С

Peak zone max.temperature

290°С

Soldering principle

Reflow

Air circulation

150 m3/h

Heating up time

Approx. 45 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

360 mm

Quantity

1

Conveyor

Width

400 mm

Type

Mesh belt

Clearance above conveyor

30 mm

Conveyor speed

300-1800 mm/мmin

Speed accuracy

≤ 30 mm/min

Ambient conditions

External temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Cable

5 wires (3 phases, N, ground)

Starting power

10 kW

Working power

2,5 kW

[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Технические данные [~DEFAULT_VALUE] => ) [FLAGS] => Array ( [ID] => 76 [TIMESTAMP_X] => 2017-02-14 15:05:33 [IBLOCK_ID] => 26 [NAME] => Функции [ACTIVE] => Y [SORT] => 500 [CODE] => FLAGS [DEFAULT_VALUE] => [PROPERTY_TYPE] => E [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => Y [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 33 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => EList [USER_TYPE_SETTINGS] => Array ( [size] => 20 [width] => 0 [group] => Y [multiple] => Y ) [HINT] => [PROPERTY_VALUE_ID] => [VALUE] => [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => [~DESCRIPTION] => [~NAME] => Функции [~DEFAULT_VALUE] => ) [IMAGE_CHAR] => Array ( [ID] => 77 [TIMESTAMP_X] => 2013-09-02 13:12:06 [IBLOCK_ID] => 26 [NAME] => Картинка характеристики [ACTIVE] => Y [SORT] => 500 [CODE] => IMAGE_CHAR [DEFAULT_VALUE] => [PROPERTY_TYPE] => F [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => Y [XML_ID] => [FILE_TYPE] => jpg, gif, bmp, png, jpeg [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => Y [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => Array ( [0] => 12114 ) [VALUE] => Array ( [0] => 6291 ) [DESCRIPTION] => Array ( [0] => soldering ) [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [0] => 6291 ) [~DESCRIPTION] => Array ( [0] => soldering ) [~NAME] => Картинка характеристики [~DEFAULT_VALUE] => ) [LOGO_IMAGE] => Array ( [ID] => 96 [TIMESTAMP_X] => 2013-09-13 14:40:22 [IBLOCK_ID] => 26 [NAME] => Логотип [ACTIVE] => Y [SORT] => 500 [CODE] => LOGO_IMAGE [DEFAULT_VALUE] => [PROPERTY_TYPE] => F [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => jpg, gif, bmp, png, jpeg [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => 12115 [VALUE] => 6337 [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => 6337 [~DESCRIPTION] => [~NAME] => Логотип [~DEFAULT_VALUE] => ) [VIDEOTEKA] => Array ( [ID] => 107 [TIMESTAMP_X] => 2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Видеотека (карточка товара) [ACTIVE] => Y [SORT] => 500 [CODE] => VIDEOTEKA [DEFAULT_VALUE] => [PROPERTY_TYPE] => G [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 38 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => 19768 [VALUE] => 215 [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => 215 [~DESCRIPTION] => [~NAME] => Видеотека (карточка товара) [~DEFAULT_VALUE] => ) [SOFT] => Array ( [ID] => 116 [TIMESTAMP_X] => 2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Программа [ACTIVE] => Y [SORT] => 500 [CODE] => SOFT [DEFAULT_VALUE] => [PROPERTY_TYPE] => S [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => Y [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => HTML [USER_TYPE_SETTINGS] => Array ( [height] => 200 ) [HINT] => [PROPERTY_VALUE_ID] => 12107 [VALUE] => Array ( [TEXT] => <p>For oven’s control the modern PC with the color graphic monitor with a diagonal 10&quot; and touch input is used. The software with the multimedia interface controls the oven in simple and convenient way and allows to control all oven’s operation including creating and editing temperature profiles. In the basic version support of the Russian and English languages is included. The number of the saved soldering programs is unlimited.</p> <br /> <table class="soft"> <tbody> <tr> <td align="justify">The user interface is based on the modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);</td> <td> <a rel="lightbox" href="/upload/media/catalog/etna/8.jpg" ><img width="300" src="/upload/media/catalog/etna/8.jpg" style="margin-left:5px" /> </a> </td> </tr> <tr> <td align="justify">Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;</td> <td> <a rel="lightbox" href="/upload/media/catalog/etna/1.jpg" ><img width="300" src="/upload/media/catalog/etna/1.jpg" style="margin-left:5px" /> </a> </td> </tr> <tr> <td align="justify">The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator.</td> <td> <a rel="lightbox" href="/upload/media/catalog/etna/2.jpg" ><img width="300" src="/upload/media/catalog/etna/2.jpg" style="margin-left:5px" /> </a> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

For oven’s control the modern PC with the color graphic monitor with a diagonal 10" and touch input is used. The software with the multimedia interface controls the oven in simple and convenient way and allows to control all oven’s operation including creating and editing temperature profiles. In the basic version support of the Russian and English languages is included. The number of the saved soldering programs is unlimited.


The user interface is based on the modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator.
[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Программа [~DEFAULT_VALUE] => ) [VIDEO_YT] => Array ( [ID] => 213 [TIMESTAMP_X] => 2016-06-28 12:35:44 [IBLOCK_ID] => 26 [NAME] => Видео YouTube [ACTIVE] => Y [SORT] => 500 [CODE] => VIDEO_YT [DEFAULT_VALUE] => [PROPERTY_TYPE] => G [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 63 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => 19769 [VALUE] => 271 [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => 271 [~DESCRIPTION] => [~NAME] => Видео YouTube [~DEFAULT_VALUE] => ) ) [DISPLAY_PROPERTIES] => Array ( [VIDEOTEKA] => Array ( [ID] => 107 [TIMESTAMP_X] => 2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Видеотека (карточка товара) [ACTIVE] => Y [SORT] => 500 [CODE] => VIDEOTEKA [DEFAULT_VALUE] => [PROPERTY_TYPE] => G [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 38 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => 19768 [VALUE] => 215 [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => 215 [~DESCRIPTION] => [~NAME] => Видеотека (карточка товара) [~DEFAULT_VALUE] => [DISPLAY_VALUE] => Печи EN [LINK_SECTION_VALUE] => Array ( [215] => Array ( [ID] => 215 [~ID] => 215 [IBLOCK_ID] => 38 [~IBLOCK_ID] => 38 [NAME] => Печи EN [~NAME] => Печи EN [SECTION_PAGE_URL] => /video/list.php?SECTION_ID=215 [~SECTION_PAGE_URL] => /video/list.php?SECTION_ID=215 [PICTURE] => [~PICTURE] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [CODE] => [~CODE] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [IBLOCK_TYPE_ID] => video [~IBLOCK_TYPE_ID] => video [IBLOCK_CODE] => flypage-video [~IBLOCK_CODE] => flypage-video [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y ) ) ) [TECH_DATA] => Array ( [ID] => 74 [TIMESTAMP_X] => 2013-09-02 13:08:12 [IBLOCK_ID] => 26 [NAME] => Технические данные [ACTIVE] => Y [SORT] => 500 [CODE] => TECH_DATA [DEFAULT_VALUE] => [PROPERTY_TYPE] => S [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => HTML [USER_TYPE_SETTINGS] => Array ( [height] => 200 ) [HINT] => [PROPERTY_VALUE_ID] => 12099 [VALUE] => Array ( [TEXT] => <table class="tech_data"> <tbody> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Dimensions, weight </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Length </p> </td> <td width="243" valign="top"> <p align="center"> 2340 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Width </p> </td> <td width="243" valign="top"> <p align="center"> 870 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Height </p> </td> <td width="243" valign="top"> <p align="center"> 1500 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Weight </p> </td> <td width="243" valign="top"> <p align="center"> 400 kg </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Floor load </p> </td> <td width="243" valign="top"> <p align="center"> 200 kg/m2 </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Process camera </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Length </p> </td> <td width="243" valign="top"> <p align="center"> 1454 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Preheating zones </p> </td> <td width="243" valign="top"> <p align="center"> 3 </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Preheating zones length </p> </td> <td width="243" valign="top"> <p align="center"> 1107 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Peak zone </p> </td> <td width="243" valign="top"> <p align="center"> 1 </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Peak zone length </p> </td> <td width="243" valign="top"> <p align="center"> 347 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> First zone max.temperature </p> </td> <td width="243" valign="top"> <p align="center"> 125°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Preheating zones max.temperature (except first) </p> </td> <td width="243" valign="top"> <p align="center"> 250°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Peak zone max.temperature </p> </td> <td width="243" valign="top"> <p align="center"> 290°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Soldering principle </p> </td> <td width="243" valign="top"> <p align="center"> Reflow </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Air circulation </p> </td> <td width="243" valign="top"> <p align="center"> 150 m3/h </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Heating up time<span dir="RTL"> </span> </p> </td> <td width="243" valign="top"> <p dir="RTL" align="center"> <span dir="LTR">Approx</span><span dir="LTR">. 45</span><span dir="LTR"> min</span><span dir="LTR"> </span> </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Temperature profile accuracy </p> </td> <td width="243" valign="top"> <p align="center"> +/-2К </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Cooling zone </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Length </p> </td> <td width="243" valign="top"> <p align="center"> 360 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Quantity </p> </td> <td width="243" valign="top"> <p align="center"> 1 </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Conveyor </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Width </p> </td> <td width="243" valign="top"> <p align="center"> 400 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Type </p> </td> <td width="243" valign="top"> <p align="center"> Mesh belt </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Clearance above conveyor </p> </td> <td width="243" valign="top"> <p align="center"> 30 mm </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Conveyor speed </p> </td> <td width="243" valign="top"> <p align="center"> 300-1800 mm/мmin </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Speed accuracy </p> </td> <td width="243" valign="top"> <p align="center"> ≤ 30 mm/min </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Ambient conditions </p> </td> </tr> <tr> <td width="402" valign="top"> <p> External temperature </p> </td> <td width="243" valign="top"> <p align="center"> 15-32°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Humidity </p> </td> <td width="243" valign="top"> <p align="center"> 30-75% </p> </td> </tr> <tr> <td colspan="3" width="645" valign="top"> <p align="center"> Electricity </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Power supply </p> </td> <td width="243" valign="top"> <p> 3х400 V +/-5% 50 Hz </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Cable </p> </td> <td width="243" valign="top"> <p> 5 wires (3 phases, N, ground) </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Starting power </p> </td> <td width="243" valign="top"> <p align="center"> 10 kW </p> </td> </tr> <tr> <td width="402" valign="top"> <p> Working power </p> </td> <td width="243" valign="top"> <p align="center"> 2,5 kW </p> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

Dimensions, weight

Length

2340 mm

Width

870 mm

Height

1500 mm

Weight

400 kg

Floor load

200 kg/m2

Process camera

Length

1454 mm

Preheating zones

3

Preheating zones length

1107 mm

Peak zone

1

Peak zone length

347 mm

First zone max.temperature

125°С

Preheating zones max.temperature (except first)

250°С

Peak zone max.temperature

290°С

Soldering principle

Reflow

Air circulation

150 m3/h

Heating up time

Approx. 45 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

360 mm

Quantity

1

Conveyor

Width

400 mm

Type

Mesh belt

Clearance above conveyor

30 mm

Conveyor speed

300-1800 mm/мmin

Speed accuracy

≤ 30 mm/min

Ambient conditions

External temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Cable

5 wires (3 phases, N, ground)

Starting power

10 kW

Working power

2,5 kW

[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Технические данные [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>

Dimensions, weight

Length

2340 mm

Width

870 mm

Height

1500 mm

Weight

400 kg

Floor load

200 kg/m2

Process camera

Length

1454 mm

Preheating zones

3

Preheating zones length

1107 mm

Peak zone

1

Peak zone length

347 mm

First zone max.temperature

125°С

Preheating zones max.temperature (except first)

250°С

Peak zone max.temperature

290°С

Soldering principle

Reflow

Air circulation

150 m3/h

Heating up time

Approx. 45 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

360 mm

Quantity

1

Conveyor

Width

400 mm

Type

Mesh belt

Clearance above conveyor

30 mm

Conveyor speed

300-1800 mm/мmin

Speed accuracy

≤ 30 mm/min

Ambient conditions

External temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Cable

5 wires (3 phases, N, ground)

Starting power

10 kW

Working power

2,5 kW

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The software with the multimedia interface controls the oven in simple and convenient way and allows to control all oven’s operation including creating and editing temperature profiles. In the basic version support of the Russian and English languages is included. The number of the saved soldering programs is unlimited.</p> <br /> <table class="soft"> <tbody> <tr> <td align="justify">The user interface is based on the modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);</td> <td> <a rel="lightbox" href="/upload/media/catalog/etna/8.jpg" ><img width="300" src="/upload/media/catalog/etna/8.jpg" style="margin-left:5px" /> </a> </td> </tr> <tr> <td align="justify">Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;</td> <td> <a rel="lightbox" href="/upload/media/catalog/etna/1.jpg" ><img width="300" src="/upload/media/catalog/etna/1.jpg" style="margin-left:5px" /> </a> </td> </tr> <tr> <td align="justify">The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator.</td> <td> <a rel="lightbox" href="/upload/media/catalog/etna/2.jpg" ><img width="300" src="/upload/media/catalog/etna/2.jpg" style="margin-left:5px" /> </a> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

For oven’s control the modern PC with the color graphic monitor with a diagonal 10" and touch input is used. The software with the multimedia interface controls the oven in simple and convenient way and allows to control all oven’s operation including creating and editing temperature profiles. In the basic version support of the Russian and English languages is included. The number of the saved soldering programs is unlimited.


The user interface is based on the modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator.
[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Программа [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>

For oven’s control the modern PC with the color graphic monitor with a diagonal 10" and touch input is used. The software with the multimedia interface controls the oven in simple and convenient way and allows to control all oven’s operation including creating and editing temperature profiles. In the basic version support of the Russian and English languages is included. The number of the saved soldering programs is unlimited.


The user interface is based on the modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator.
) ) [PRODUCT_PROPERTIES] => Array ( ) [PRODUCT_PROPERTIES_FILL] => Array ( ) [MORE_PHOTO] => Array ( ) [LINKED_ELEMENTS] => Array ( ) [SECTION] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 20.07.2016 12:22:41 [~TIMESTAMP_X] => 20.07.2016 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 06.07.2016 13:34:41 [~DATE_CREATE] => 06.07.2016 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [CODE] => reflow-soldering [~CODE] => reflow-soldering [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/reflow-soldering/ [~SECTION_PAGE_URL] => /en/equipment/reflow-soldering/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [PATH] => Array ( [0] => Array ( [ID] => 45 [~ID] => 45 [TIMESTAMP_X] => 2016-07-20 11:46:40 [~TIMESTAMP_X] => 2016-07-20 11:46:40 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2013-09-02 09:56:05 [~DATE_CREATE] => 2013-09-02 09:56:05 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => [~IBLOCK_SECTION_ID] => [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 500 [~SORT] => 500 [NAME] => SMT equipment [~NAME] => SMT equipment [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 3 [~LEFT_MARGIN] => 3 [RIGHT_MARGIN] => 16 [~RIGHT_MARGIN] => 16 [DEPTH_LEVEL] => 1 [~DEPTH_LEVEL] => 1 [DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[~DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [~SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [CODE] => equipment [~CODE] => equipment [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/ [~SECTION_PAGE_URL] => /en/equipment/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [IPROPERTY_VALUES] => Array ( ) ) [1] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 2016-07-20 12:22:41 [~TIMESTAMP_X] => 2016-07-20 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2016-07-06 13:34:41 [~DATE_CREATE] => 2016-07-06 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. 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This compact oven is intended for the PCBs soldering in the hot air environment. The soldering temperature in the process camera and also other parameters are preset by means of the operating computer. PCBs loading on the mesh conveyor of the oven is carried out manually. The oven’s process camera includes preheating zones, a peak zone and a cooling zone. PCBs unloading is also carried out manually.

Etna B211-AC311 is equipped with four heating zones:

- three preheating zones

- one peak zone

Hot air flow, in all heating zones organized from the top and the bottom sides. A special design of the nozzles allows to provide the qualitative soldering of electronic components regardless of their shape and the size. Process stability is maintained due to minimizing of mutual influence neighbouring heating zones to each other.

Control over a temperature profile in the process camera is executed by means of thermocouples individually for each zone. Automatic adjustment system provides accuracy of temperature profile in each heating zone. PCBs cooling is carried out in the active cooling zone.

In this model of the oven, the mesh belt conveyor allowing to make simultaneous loading of PCBs with different dimensions. It’s very important for prototype productions.

The digital speed regulator provides stable mesh belt moving regardless of temperature or load of the conveyor.

The oven’s control executed by means of modern computer supplied with the color touchscreen monitor (10"). The software with the multimedia interface allows execute oven’s control in the simple and convenient way. The basic version includes support of the Russian and English languages. The number of saved soldering programs is unlimited.

Dimensions, weight

Length

2340 mm

Width

870 mm

Height

1500 mm

Weight

400 kg

Floor load

200 kg/m2

Process camera

Length

1454 mm

Preheating zones

3

Preheating zones length

1107 mm

Peak zone

1

Peak zone length

347 mm

First zone max.temperature

125°С

Preheating zones max.temperature (except first)

250°С

Peak zone max.temperature

290°С

Soldering principle

Reflow

Air circulation

150 m3/h

Heating up time

Approx. 45 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

360 mm

Quantity

1

Conveyor

Width

400 mm

Type

Mesh belt

Clearance above conveyor

30 mm

Conveyor speed

300-1800 mm/мmin

Speed accuracy

≤ 30 mm/min

Ambient conditions

External temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Cable

5 wires (3 phases, N, ground)

Starting power

10 kW

Working power

2,5 kW

For oven’s control the modern PC with the color graphic monitor with a diagonal 10" and touch input is used. The software with the multimedia interface controls the oven in simple and convenient way and allows to control all oven’s operation including creating and editing temperature profiles. In the basic version support of the Russian and English languages is included. The number of the saved soldering programs is unlimited.


The user interface is based on the modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);
Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;
The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator.