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                        <p class="a" align="center">Weight and dimensions values</p>
                    </td> </tr>

                <tr> <td colspan="2"> 
                        <p>Length</p>
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                        <p class="a" align="center">1390 mm</p>
                    </td> </tr>

                <tr> <td colspan="2"> 
                        <p>Width</p>
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                        <p class="a" align="center">770 mm</p>
                    </td> </tr>

                <tr> <td colspan="2"> 
                        <p>Height</p>
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                        <p class="a" align="center">370 mm</p>
                    </td> </tr>

                <tr> <td colspan="2"> 
                        <p>Weight</p>
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                        <p class="a" align="center">100 kg</p>
                    </td> </tr>

                <tr> <td colspan="3"> 
                        <p class="a" align="center">Parameters of  working area</p>
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				<tr> <td colspan="2"> 
                        <p>Heater type</p>
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                        <p class="a" align="center">Forced convection</p>
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                <tr> <td colspan="2"> 
                        <p>Maximum temperature</p>
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                <tr> <td colspan="2"> 
                        <p>Heating time (output on soldering mode)</p>
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                <tr> <td colspan="2"> 
                        <p>The maximum dimensions of the processed printed circuit boards</p>
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                        <p class="a" align="center">340х430 mm</p>
                    </td> </tr>                

                <tr> <td colspan="2"> 
                        <p>The maximum height of the printed circuit board components</p>
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                        <p class="a" align="center">30 mm</p>
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                <tr> <td colspan="3"> 
                        <p class="a" align="center">Electrical connection</p>
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                <tr> <td colspan="2"> 
                        <p>Power</p>
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                        <p>220V, 50 Hz</p>
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                        <p>Power consumption</p>
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                        <p>1.5kW, max 4 kW</p>
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Weight and dimensions values

Length

1390 mm

Width

770 mm

Height

370 mm

Weight

100 kg

Parameters of working area

Heater type

Forced convection

Maximum temperature

260 °С

Heating time (output on soldering mode)

20 min

The maximum dimensions of the processed printed circuit boards

340х430 mm

The maximum height of the printed circuit board components

30 mm

Electrical connection

Power

220V, 50 Hz

Power consumption

1.5kW, max 4 kW

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For control of the Oven the modern microcomputer with touch input is used. The intuitive software interface makes oven operation simple and straightforward. In a main window of the program all necessary governing bodies, the schedule of temperatures fixed by thermocouples, the Start and Stop buttons, etc. are located. Программа
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Weight and dimensions values

Length

1390 mm

Width

770 mm

Height

370 mm

Weight

100 kg

Parameters of working area

Heater type

Forced convection

Maximum temperature

260 °С

Heating time (output on soldering mode)

20 min

The maximum dimensions of the processed printed circuit boards

340х430 mm

The maximum height of the printed circuit board components

30 mm

Electrical connection

Power

220V, 50 Hz

Power consumption

1.5kW, max 4 kW

[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Технические данные [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>

Weight and dimensions values

Length

1390 mm

Width

770 mm

Height

370 mm

Weight

100 kg

Parameters of working area

Heater type

Forced convection

Maximum temperature

260 °С

Heating time (output on soldering mode)

20 min

The maximum dimensions of the processed printed circuit boards

340х430 mm

The maximum height of the printed circuit board components

30 mm

Electrical connection

Power

220V, 50 Hz

Power consumption

1.5kW, max 4 kW

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The intuitive software interface makes oven operation simple and straightforward. In a main window of the program all necessary governing bodies, the schedule of temperatures fixed by thermocouples, the Start and Stop buttons, etc. are located. </td> <td> <a class="fancybox" href="/upload/medialibrary/450/450aa877c865f8157fa6c7719ae4438e.png"><img src="/upload/medialibrary/450/450aa877c865f8157fa6c7719ae4438e.png" alt="Программа" style="margin-left:5px" title="Программа" width="300"> </a> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>
For control of the Oven the modern microcomputer with touch input is used. The intuitive software interface makes oven operation simple and straightforward. In a main window of the program all necessary governing bodies, the schedule of temperatures fixed by thermocouples, the Start and Stop buttons, etc. are located. Программа
[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Программа [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>
For control of the Oven the modern microcomputer with touch input is used. The intuitive software interface makes oven operation simple and straightforward. In a main window of the program all necessary governing bodies, the schedule of temperatures fixed by thermocouples, the Start and Stop buttons, etc. are located. Программа
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Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [CODE] => reflow-soldering [~CODE] => reflow-soldering [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/reflow-soldering/ [~SECTION_PAGE_URL] => /en/equipment/reflow-soldering/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [PATH] => Array ( [0] => Array ( [ID] => 45 [~ID] => 45 [TIMESTAMP_X] => 2016-07-20 11:46:40 [~TIMESTAMP_X] => 2016-07-20 11:46:40 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2013-09-02 09:56:05 [~DATE_CREATE] => 2013-09-02 09:56:05 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => [~IBLOCK_SECTION_ID] => [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 500 [~SORT] => 500 [NAME] => SMT equipment [~NAME] => SMT equipment [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 3 [~LEFT_MARGIN] => 3 [RIGHT_MARGIN] => 16 [~RIGHT_MARGIN] => 16 [DEPTH_LEVEL] => 1 [~DEPTH_LEVEL] => 1 [DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[~DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [~SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [CODE] => equipment [~CODE] => equipment [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/ [~SECTION_PAGE_URL] => /en/equipment/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [IPROPERTY_VALUES] => Array ( ) ) [1] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 2016-07-20 12:22:41 [~TIMESTAMP_X] => 2016-07-20 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2016-07-06 13:34:41 [~DATE_CREATE] => 2016-07-06 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. 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Weight and dimensions values

Length

1390 mm

Width

770 mm

Height

370 mm

Weight

100 kg

Parameters of working area

Heater type

Forced convection

Maximum temperature

260 °С

Heating time (output on soldering mode)

20 min

The maximum dimensions of the processed printed circuit boards

340х430 mm

The maximum height of the printed circuit board components

30 mm

Electrical connection

Power

220V, 50 Hz

Power consumption

1.5kW, max 4 kW

termopara.pngEquipping of the Oven with external thermocouples will provide information about the temperature directly from the PCB. The received values of temperature are displayed.

Станина для печиThe table based on the stable metal welded frame. The table covered with special paint. Table covering with different color paints is executing on demand.

For control of the Oven the modern microcomputer with touch input is used. The intuitive software interface makes oven operation simple and straightforward. In a main window of the program all necessary governing bodies, the schedule of temperatures fixed by thermocouples, the Start and Stop buttons, etc. are located. Программа

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