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    [NAME] => Reflow oven Etna B221-AC533
    [~NAME] => Reflow oven Etna B221-AC533
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    [PREVIEW_TEXT] => This conveyor reflow oven is intended for the PCBs soldering in the air environment. The oven can be use as inline system or in stand alone mode.
    [~PREVIEW_TEXT] => This conveyor reflow oven is intended for the PCBs soldering in the air environment. The oven can be use as inline system or in stand alone mode.
    [PREVIEW_TEXT_TYPE] => text
    [~PREVIEW_TEXT_TYPE] => text
    [DETAIL_TEXT] => 

This conveyor reflow oven is intended for the PCBs soldering in the air environment. The oven can be use as inline system or in stand alone mode. The soldering temperature in the process-camera and also other parameters are set by means of the operating computer. PCBs with the applied solder paste and the assembled components are transferred on the chain conveyor manually or move automatically from the previous device of the line. Moving on the conveyor, PCBs consistently pass through preheating zones, peak zones and a cooling zone. PCBs unloading from the oven's outlet is carried out manually or by transfer on the following device of the line. Thanks to active cooling system, temperature of unloaded PCBs is close to the room temperature.

The oven is equipped with eight heating zones (five preheating zones and three peak zones). Cooling zone consists of three active cooling sections. In all heating zones of heating hot air supplied the top and bottom sides. A special design of hot air supply system allows to provide the qualitative soldering of electronic components regardless of their bodies and dimensions. Besides, stability of soldering process is provided due to minimizing of mutual influence of heating zones.

Temperature profile control in the process camera is carried out by means of thermocouples, individually for each zone. Automatic control system allows to keep the preset profile with high precision. The profile is formed by independent temperature settings for each zone.

PCBs cooling after soldering process is carried out in active cooling zone. The cooled air is prepared by means of water cooling system with the built-in conditioner. The cooling system is equipped with replaceable filters for purification of air.

Oven is equipped with pin-chain conveyor. For heavy or flexible PCBs transportation the conveyor is equipped with central board support system (CBS). Width of the conveyor and CBS is set in the software and change automatically by means of electrical drives. Conveyor rails positions also can be changed manually. CBS rail can be moved to lowered position if there no necessity to use it.

Conveyor is equipped with automatic greasing system of conveyor and CBS chains. Frequency and duration of greasing are preset in software.

Digital regulator is providing stable conveyor speed regardless of time, temperature and quantity of loaded PCBs. Conveyor speed is set in softwarer in a wide range: from 180mm/min to 1800mm/min.

In the software there is function of visualization PCBs passing through process-camera. Besides, software indicates emergency situations e.g.: a PCB jam on inlet or outlet or PCB falling from conveyor chains.

Communication with previous and following devices of the line is carried out by means of the SMEMA interface. Delay between PCBs loading from the previous conveyor is programmable.

The oven's software allows to adjust various economy modes of the electrical power. For example, the maximum value of power consumption for each heating zone can be set individually. Settings of these values help to adjust balance between conveyor speed and energy consumption.

Automatic mode is provided by PC which supplied with the color graphic touchscreen monitor (22"). The software with the multimedia interface allows execute full control of the oven in simple and convenient way. Soldering profiles also created in the software. User interface language can be changed by the operator. Basic delivery includes support only Russian. At the request other languages can be installed.

All individual profile parameters can be saved under any name for future use. The quantity of the saved profiles is unlimited.

[~DETAIL_TEXT] =>

This conveyor reflow oven is intended for the PCBs soldering in the air environment. The oven can be use as inline system or in stand alone mode. The soldering temperature in the process-camera and also other parameters are set by means of the operating computer. PCBs with the applied solder paste and the assembled components are transferred on the chain conveyor manually or move automatically from the previous device of the line. Moving on the conveyor, PCBs consistently pass through preheating zones, peak zones and a cooling zone. PCBs unloading from the oven's outlet is carried out manually or by transfer on the following device of the line. Thanks to active cooling system, temperature of unloaded PCBs is close to the room temperature.

The oven is equipped with eight heating zones (five preheating zones and three peak zones). Cooling zone consists of three active cooling sections. In all heating zones of heating hot air supplied the top and bottom sides. A special design of hot air supply system allows to provide the qualitative soldering of electronic components regardless of their bodies and dimensions. Besides, stability of soldering process is provided due to minimizing of mutual influence of heating zones.

Temperature profile control in the process camera is carried out by means of thermocouples, individually for each zone. Automatic control system allows to keep the preset profile with high precision. The profile is formed by independent temperature settings for each zone.

PCBs cooling after soldering process is carried out in active cooling zone. The cooled air is prepared by means of water cooling system with the built-in conditioner. The cooling system is equipped with replaceable filters for purification of air.

Oven is equipped with pin-chain conveyor. For heavy or flexible PCBs transportation the conveyor is equipped with central board support system (CBS). Width of the conveyor and CBS is set in the software and change automatically by means of electrical drives. Conveyor rails positions also can be changed manually. CBS rail can be moved to lowered position if there no necessity to use it.

Conveyor is equipped with automatic greasing system of conveyor and CBS chains. Frequency and duration of greasing are preset in software.

Digital regulator is providing stable conveyor speed regardless of time, temperature and quantity of loaded PCBs. Conveyor speed is set in softwarer in a wide range: from 180mm/min to 1800mm/min.

In the software there is function of visualization PCBs passing through process-camera. Besides, software indicates emergency situations e.g.: a PCB jam on inlet or outlet or PCB falling from conveyor chains.

Communication with previous and following devices of the line is carried out by means of the SMEMA interface. Delay between PCBs loading from the previous conveyor is programmable.

The oven's software allows to adjust various economy modes of the electrical power. For example, the maximum value of power consumption for each heating zone can be set individually. Settings of these values help to adjust balance between conveyor speed and energy consumption.

Automatic mode is provided by PC which supplied with the color graphic touchscreen monitor (22"). The software with the multimedia interface allows execute full control of the oven in simple and convenient way. Soldering profiles also created in the software. User interface language can be changed by the operator. Basic delivery includes support only Russian. At the request other languages can be installed.

All individual profile parameters can be saved under any name for future use. The quantity of the saved profiles is unlimited.

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valign="top"> <p>Weight</p> </td> <td width="243" valign="top"> <p align="center">2550 kg </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Floor load</p> </td> <td width="243" valign="top"> <p align="center">400 kg/m2 </p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Process-camera parameters</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Length</p> </td> <td width="243" valign="top"> <p align="center">4240 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Preheating zones quantity</p> </td> <td width="243" valign="top"> <p align="center">5</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Preheating zones length</p> </td> <td width="243" valign="top"> <p align="center">1750 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Peak zones quantity</p> </td> <td width="243" valign="top"> <p align="center">3</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Peak zones length</p> </td> <td width="243" valign="top"> <p align="center">1050</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Max.temperature in the 1st zone</p> </td> <td width="243" valign="top"> <p align="center">250°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Max.temperature in preheating zones (except 1st)</p> </td> <td width="243" valign="top"> <p align="center">300°С</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Max.temperature in peak zones</p> </td> <td width="243" valign="top"> <p align="center">350°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Thermal system</p> </td> <td width="243" valign="top"> <p align="center">Reflow</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Gas circulation in heating zones</p> </td> <td width="243" valign="top"> <p align="center">350 m3/h </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Warm up time (soldering mode)</p> </td> <td width="243" valign="top"> <p align="center" dir="RTL"><span dir="RTL"> </span><span dir="RTL"> </span><span dir="RTL"> </span><span dir="RTL"> </span> <span dir="LTR">about</span><span dir="LTR"> 30 min</span><span dir="LTR"> </span></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Temperature profile accuracy</p> </td> <td width="243" valign="top"> <p align="center">+/-2К</p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Cooling zone</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Length </p> </td> <td width="243" valign="top"> <p align="center">1050 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Sections quantity</p> </td> <td width="243" valign="top"> <p align="center">3</p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Conveyor parameters</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Conveyor width (adjustable)</p> </td> <td width="243" valign="top"> <p align="center">70-430 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Conveyor type</p> </td> <td width="243" valign="top"> <p align="center">Pin-chain 3 mm <br /> (on demand 5 mm)</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Top PCB side clearance</p> </td> <td width="243" valign="top"> <p align="center">30 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Bottom PCB side clearance</p> </td> <td width="243" valign="top"> <p align="center">14 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Conveyor speed</p> </td> <td width="243" valign="top"> <p align="center">180-1800 mm/min</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Speed deviation</p> </td> <td width="243" valign="top"> <p align="center">≤ 18 mm/min </p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>External environment</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Ambient temperature</p> </td> <td width="243" valign="top"> <p align="center">15-32°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Humidity</p> </td> <td width="243" valign="top"> <p align="center">30-75%</p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Electricity</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Power supply</p> </td> <td width="243" valign="top"> <p>3х400 V +/-5% 50 Hz</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Power cable</p> </td> <td width="243" valign="top"> <p>5 wires (3 phases, N, ground)</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Start power consumption</p> </td> <td width="243" valign="top"> <p align="center">Up to 54 kW</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Work power consumption</p> </td> <td width="243" valign="top"> <p align="center">10 kW</p> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

Dimensions and weight

Length

5000 mm

Width

1480 mm

Height

1740 mm

Weight

2550 kg

Floor load

400 kg/m2

Process-camera parameters

Length

4240 mm

Preheating zones quantity

5

Preheating zones length

1750 mm

Peak zones quantity

3

Peak zones length

1050

Max.temperature in the 1st zone

250°С

Max.temperature in preheating zones (except 1st)

300°С

Max.temperature in peak zones

350°С

Thermal system

Reflow

Gas circulation in heating zones

350 m3/h

Warm up time (soldering mode)

 about 30 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

1050 mm

Sections quantity

3

Conveyor parameters

Conveyor width (adjustable)

70-430 mm

Conveyor type

Pin-chain 3 mm
(on demand 5 mm)

Top PCB side clearance

30 mm

Bottom PCB side clearance

14 mm

Conveyor speed

180-1800 mm/min

Speed deviation

≤ 18 mm/min

External environment

Ambient temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Power cable

5 wires (3 phases, N, ground)

Start power consumption

Up to 54 kW

Work power consumption

10 kW

[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Технические данные [~DEFAULT_VALUE] => ) [FLAGS] => Array ( [ID] => 76 [TIMESTAMP_X] => 2017-02-14 15:05:33 [IBLOCK_ID] => 26 [NAME] => Функции [ACTIVE] => Y [SORT] => 500 [CODE] => FLAGS [DEFAULT_VALUE] => [PROPERTY_TYPE] => E [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => Y [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 33 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => EList [USER_TYPE_SETTINGS] => Array ( [size] => 20 [width] => 0 [group] => Y [multiple] => Y ) [HINT] => [PROPERTY_VALUE_ID] => Array ( [0] => 19867 [1] => 19868 [2] => 19869 [3] => 19870 [4] => 19871 [5] => 19872 ) [VALUE] => Array ( [0] => 282 [1] => 280 [2] => 284 [3] => 283 [4] => 272 [5] => 281 ) [DESCRIPTION] => Array ( [0] => [1] => [2] => [3] => [4] => [5] => ) [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [0] => 282 [1] => 280 [2] => 284 [3] => 283 [4] => 272 [5] => 281 ) [~DESCRIPTION] => Array ( [0] => [1] => [2] => [3] => [4] => [5] => ) [~NAME] => Функции [~DEFAULT_VALUE] => ) [IMAGE_CHAR] => Array ( [ID] => 77 [TIMESTAMP_X] => 2013-09-02 13:12:06 [IBLOCK_ID] => 26 [NAME] => Картинка характеристики [ACTIVE] => Y [SORT] => 500 [CODE] => IMAGE_CHAR [DEFAULT_VALUE] => [PROPERTY_TYPE] => F [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => Y [XML_ID] => [FILE_TYPE] => jpg, gif, bmp, png, jpeg [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => Y [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => Array ( [0] => 11944 ) [VALUE] => Array ( [0] => 6272 ) [DESCRIPTION] => Array ( [0] => soldering ) [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [0] => 6272 ) [~DESCRIPTION] => Array ( [0] => soldering ) [~NAME] => Картинка характеристики [~DEFAULT_VALUE] => ) [LOGO_IMAGE] => Array ( [ID] => 96 [TIMESTAMP_X] => 2013-09-13 14:40:22 [IBLOCK_ID] => 26 [NAME] => Логотип [ACTIVE] => Y [SORT] => 500 [CODE] => LOGO_IMAGE [DEFAULT_VALUE] => [PROPERTY_TYPE] => F [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => jpg, gif, bmp, png, jpeg [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => 11945 [VALUE] => 6338 [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => 6338 [~DESCRIPTION] => [~NAME] => Логотип [~DEFAULT_VALUE] => ) [VIDEOTEKA] => Array ( [ID] => 107 [TIMESTAMP_X] => 2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Видеотека (карточка товара) [ACTIVE] => Y [SORT] => 500 [CODE] => VIDEOTEKA [DEFAULT_VALUE] => [PROPERTY_TYPE] => G [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 38 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => [VALUE] => [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => [~DESCRIPTION] => [~NAME] => Видеотека (карточка товара) [~DEFAULT_VALUE] => ) [SOFT] => Array ( [ID] => 116 [TIMESTAMP_X] => 2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Программа [ACTIVE] => Y [SORT] => 500 [CODE] => SOFT [DEFAULT_VALUE] => [PROPERTY_TYPE] => S [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => Y [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => HTML [USER_TYPE_SETTINGS] => Array ( [height] => 200 ) [HINT] => [PROPERTY_VALUE_ID] => 11969 [VALUE] => Array ( [TEXT] => <table class="soft"> <tbody> <tr><td> <p align="justify">The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.); <br /> </p> <p align="justify">Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse; <br /> </p> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" ><img src="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" title="1" border="0" alt="1" width="300" height="400" /> <br /> </a> <br /> </div> </td></tr> <tr><td align="justify"> The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator; <br /> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" ><img src="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" title="2" border="0" alt="22.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> Control elements are included in animated graphic blocks with grouped in a logical way information; <br /> </div> <div align="justify"> Animated monitoring and control system allows to see all processes running inside the oven; <br /> </div> <div align="justify"> For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" ><img src="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" title="3" border="0" alt="44.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields; <br /> </div> <div align="justify">The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" ><img src="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" title="4" border="0" alt="22.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven; <br /> </div> <div align="justify"> There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week); <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" ><img src="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" title="5" border="0" alt="55.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long; <br /> </div> <div align="justify"> The automatic screen blocking function helps to avoid casual change of a profile or oven's setup; </div> <div align="justify">Various settings of the oven are carried out also by means of the graphic interface.</div> </td><td> <div align="center" style="margin-left: 20px;"> <a href="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" rel="lightbox" ><img src="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" title="5" border="0" alt="33.png" width="300" /> <br /> </a></div> </td></tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);

Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;

The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.
[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Программа [~DEFAULT_VALUE] => ) [VIDEO_YT] => Array ( [ID] => 213 [TIMESTAMP_X] => 2016-06-28 12:35:44 [IBLOCK_ID] => 26 [NAME] => Видео YouTube [ACTIVE] => Y [SORT] => 500 [CODE] => VIDEO_YT [DEFAULT_VALUE] => [PROPERTY_TYPE] => G [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 63 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => [USER_TYPE_SETTINGS] => [HINT] => [PROPERTY_VALUE_ID] => [VALUE] => [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => [~DESCRIPTION] => [~NAME] => Видео YouTube [~DEFAULT_VALUE] => ) ) [DISPLAY_PROPERTIES] => Array ( [TECH_DATA] => Array ( [ID] => 74 [TIMESTAMP_X] => 2013-09-02 13:08:12 [IBLOCK_ID] => 26 [NAME] => Технические данные [ACTIVE] => Y [SORT] => 500 [CODE] => TECH_DATA [DEFAULT_VALUE] => [PROPERTY_TYPE] => S [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => N [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => HTML [USER_TYPE_SETTINGS] => Array ( [height] => 200 ) [HINT] => [PROPERTY_VALUE_ID] => 11937 [VALUE] => Array ( [TEXT] => <table class="tech_data"> <tbody> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Dimensions and weight</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Length</p> </td> <td width="243" valign="top"> <p align="center">5000 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Width</p> </td> <td width="243" valign="top"> <p align="center">1480 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Height</p> </td> <td width="243" valign="top"> <p align="center">1740 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Weight</p> </td> <td width="243" valign="top"> <p align="center">2550 kg </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Floor load</p> </td> <td width="243" valign="top"> <p align="center">400 kg/m2 </p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Process-camera parameters</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Length</p> </td> <td width="243" valign="top"> <p align="center">4240 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Preheating zones quantity</p> </td> <td width="243" valign="top"> <p align="center">5</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Preheating zones length</p> </td> <td width="243" valign="top"> <p align="center">1750 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Peak zones quantity</p> </td> <td width="243" valign="top"> <p align="center">3</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Peak zones length</p> </td> <td width="243" valign="top"> <p align="center">1050</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Max.temperature in the 1st zone</p> </td> <td width="243" valign="top"> <p align="center">250°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Max.temperature in preheating zones (except 1st)</p> </td> <td width="243" valign="top"> <p align="center">300°С</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Max.temperature in peak zones</p> </td> <td width="243" valign="top"> <p align="center">350°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Thermal system</p> </td> <td width="243" valign="top"> <p align="center">Reflow</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Gas circulation in heating zones</p> </td> <td width="243" valign="top"> <p align="center">350 m3/h </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Warm up time (soldering mode)</p> </td> <td width="243" valign="top"> <p align="center" dir="RTL"><span dir="RTL"> </span><span dir="RTL"> </span><span dir="RTL"> </span><span dir="RTL"> </span> <span dir="LTR">about</span><span dir="LTR"> 30 min</span><span dir="LTR"> </span></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Temperature profile accuracy</p> </td> <td width="243" valign="top"> <p align="center">+/-2К</p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Cooling zone</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Length </p> </td> <td width="243" valign="top"> <p align="center">1050 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Sections quantity</p> </td> <td width="243" valign="top"> <p align="center">3</p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Conveyor parameters</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Conveyor width (adjustable)</p> </td> <td width="243" valign="top"> <p align="center">70-430 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Conveyor type</p> </td> <td width="243" valign="top"> <p align="center">Pin-chain 3 mm <br /> (on demand 5 mm)</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Top PCB side clearance</p> </td> <td width="243" valign="top"> <p align="center">30 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Bottom PCB side clearance</p> </td> <td width="243" valign="top"> <p align="center">14 mm</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Conveyor speed</p> </td> <td width="243" valign="top"> <p align="center">180-1800 mm/min</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Speed deviation</p> </td> <td width="243" valign="top"> <p align="center">≤ 18 mm/min </p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>External environment</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Ambient temperature</p> </td> <td width="243" valign="top"> <p align="center">15-32°С </p> </td> </tr> <tr> <td width="402" valign="top"> <p>Humidity</p> </td> <td width="243" valign="top"> <p align="center">30-75%</p> </td> </tr> <tr> <td width="645" valign="top" colspan="3"> <p align="center"><strong>Electricity</strong></p> </td> </tr> <tr> <td width="402" valign="top"> <p>Power supply</p> </td> <td width="243" valign="top"> <p>3х400 V +/-5% 50 Hz</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Power cable</p> </td> <td width="243" valign="top"> <p>5 wires (3 phases, N, ground)</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Start power consumption</p> </td> <td width="243" valign="top"> <p align="center">Up to 54 kW</p> </td> </tr> <tr> <td width="402" valign="top"> <p>Work power consumption</p> </td> <td width="243" valign="top"> <p align="center">10 kW</p> </td> </tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

Dimensions and weight

Length

5000 mm

Width

1480 mm

Height

1740 mm

Weight

2550 kg

Floor load

400 kg/m2

Process-camera parameters

Length

4240 mm

Preheating zones quantity

5

Preheating zones length

1750 mm

Peak zones quantity

3

Peak zones length

1050

Max.temperature in the 1st zone

250°С

Max.temperature in preheating zones (except 1st)

300°С

Max.temperature in peak zones

350°С

Thermal system

Reflow

Gas circulation in heating zones

350 m3/h

Warm up time (soldering mode)

 about 30 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

1050 mm

Sections quantity

3

Conveyor parameters

Conveyor width (adjustable)

70-430 mm

Conveyor type

Pin-chain 3 mm
(on demand 5 mm)

Top PCB side clearance

30 mm

Bottom PCB side clearance

14 mm

Conveyor speed

180-1800 mm/min

Speed deviation

≤ 18 mm/min

External environment

Ambient temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Power cable

5 wires (3 phases, N, ground)

Start power consumption

Up to 54 kW

Work power consumption

10 kW

[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Технические данные [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>

Dimensions and weight

Length

5000 mm

Width

1480 mm

Height

1740 mm

Weight

2550 kg

Floor load

400 kg/m2

Process-camera parameters

Length

4240 mm

Preheating zones quantity

5

Preheating zones length

1750 mm

Peak zones quantity

3

Peak zones length

1050

Max.temperature in the 1st zone

250°С

Max.temperature in preheating zones (except 1st)

300°С

Max.temperature in peak zones

350°С

Thermal system

Reflow

Gas circulation in heating zones

350 m3/h

Warm up time (soldering mode)

 about 30 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

1050 mm

Sections quantity

3

Conveyor parameters

Conveyor width (adjustable)

70-430 mm

Conveyor type

Pin-chain 3 mm
(on demand 5 mm)

Top PCB side clearance

30 mm

Bottom PCB side clearance

14 mm

Conveyor speed

180-1800 mm/min

Speed deviation

≤ 18 mm/min

External environment

Ambient temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Power cable

5 wires (3 phases, N, ground)

Start power consumption

Up to 54 kW

Work power consumption

10 kW

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2016-05-24 14:12:39 [IBLOCK_ID] => 26 [NAME] => Программа [ACTIVE] => Y [SORT] => 500 [CODE] => SOFT [DEFAULT_VALUE] => [PROPERTY_TYPE] => S [ROW_COUNT] => 1 [COL_COUNT] => 30 [LIST_TYPE] => L [MULTIPLE] => N [XML_ID] => [FILE_TYPE] => [MULTIPLE_CNT] => 5 [TMP_ID] => [LINK_IBLOCK_ID] => 0 [WITH_DESCRIPTION] => N [SEARCHABLE] => Y [FILTRABLE] => N [IS_REQUIRED] => N [VERSION] => 1 [USER_TYPE] => HTML [USER_TYPE_SETTINGS] => Array ( [height] => 200 ) [HINT] => [PROPERTY_VALUE_ID] => 11969 [VALUE] => Array ( [TEXT] => <table class="soft"> <tbody> <tr><td> <p align="justify">The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.); <br /> </p> <p align="justify">Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse; <br /> </p> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" ><img src="/upload/medialibrary/ef9/ef9b4bbbc0fdc6ac8871487b3672caf7.jpg" title="1" border="0" alt="1" width="300" height="400" /> <br /> </a> <br /> </div> </td></tr> <tr><td align="justify"> The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator; <br /> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" ><img src="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" title="2" border="0" alt="22.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> Control elements are included in animated graphic blocks with grouped in a logical way information; <br /> </div> <div align="justify"> Animated monitoring and control system allows to see all processes running inside the oven; <br /> </div> <div align="justify"> For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" ><img src="/upload/medialibrary/b12/b1291d79cb9f46cae064065bfa60f374.png" title="3" border="0" alt="44.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields; <br /> </div> <div align="justify">The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators; <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" ><img src="/upload/medialibrary/0e2/0e26850b3d55dbff43e1173c3b0d8341.png" title="4" border="0" alt="22.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven; <br /> </div> <div align="justify"> There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week); <br /> </div> </td><td> <div align="center" style="margin-left: 20px;"> <a rel="lightbox" href="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" ><img src="/upload/medialibrary/dc5/dc58c4e03a8c97453356f1304c1cc1ac.png" title="5" border="0" alt="55.png" width="300" /> <br /> </a> <br /> </div> </td></tr> <tr><td> <div align="justify"> Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long; <br /> </div> <div align="justify"> The automatic screen blocking function helps to avoid casual change of a profile or oven's setup; </div> <div align="justify">Various settings of the oven are carried out also by means of the graphic interface.</div> </td><td> <div align="center" style="margin-left: 20px;"> <a href="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" rel="lightbox" ><img src="/upload/medialibrary/c62/c622681efb3baa488cb9312af9eee4f5.png" title="5" border="0" alt="33.png" width="300" /> <br /> </a></div> </td></tr> </tbody> </table> [TYPE] => html ) [DESCRIPTION] => [VALUE_ENUM] => [VALUE_XML_ID] => [VALUE_SORT] => [~VALUE] => Array ( [TEXT] =>

The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);

Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;

The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.
[TYPE] => html ) [~DESCRIPTION] => [~NAME] => Программа [~DEFAULT_VALUE] => [DISPLAY_VALUE] =>

The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);

Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;

The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.
) ) [PRODUCT_PROPERTIES] => Array ( ) [PRODUCT_PROPERTIES_FILL] => Array ( ) [MORE_PHOTO] => Array ( ) [LINKED_ELEMENTS] => Array ( ) [SECTION] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 20.07.2016 12:22:41 [~TIMESTAMP_X] => 20.07.2016 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 06.07.2016 13:34:41 [~DATE_CREATE] => 06.07.2016 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [CODE] => reflow-soldering [~CODE] => reflow-soldering [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/reflow-soldering/ [~SECTION_PAGE_URL] => /en/equipment/reflow-soldering/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [PATH] => Array ( [0] => Array ( [ID] => 45 [~ID] => 45 [TIMESTAMP_X] => 2016-07-20 11:46:40 [~TIMESTAMP_X] => 2016-07-20 11:46:40 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2013-09-02 09:56:05 [~DATE_CREATE] => 2013-09-02 09:56:05 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => [~IBLOCK_SECTION_ID] => [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 500 [~SORT] => 500 [NAME] => SMT equipment [~NAME] => SMT equipment [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 3 [~LEFT_MARGIN] => 3 [RIGHT_MARGIN] => 16 [~RIGHT_MARGIN] => 16 [DEPTH_LEVEL] => 1 [~DEPTH_LEVEL] => 1 [DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[~DESCRIPTION] =>

Dial-Company is a Russian SMT manufacturer. Our equipment is for different aims: from surface mount to shelf storage of products.

We have different equipments for: Stencil printing, Reflow soldering, PCBS’ Transporting, PCBs’ repairing, PCBs’ storage.

Stencil printing

SMT equipment (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed circuit boards (PCBs) in small and high volume manufacturing. Wide range of solutions and many settings make our printers multi-purpose; guarantying PCBs producing of any complexity according to a customer’s willing.

Reflow soldering

The main SMT equipment for reflow soldering is a reflow oven “ETNA”. It has conveyor system, transporting PCBs between the thermal zones. The definite number of each of the zones (preheat, thermal soak (often shortened to just soak), reflow, and cooling), the system of establishment of inert atmosphere while soldering, the type of conveyor (wire-belt, chain or mixed) help to choose an oven even for specific products.

Transport equipment

There are 2 types of SMT transport equipment: conveyor systems and PCBs loaders/unloaders. The main aim is to load the PCB’s into the production line, transporting them between other equipment in the line, unload and pushing PCBs into the magazine racks. At the time of order a customer can adjust the width and the length of the conveyor system. Loaders and unloaders provide a desired automation level for high volume manufacturing.

Automatic service stations

The main aim of this equipment is operating with electronic SMD elements on the PCBs: removal and installation of electronic components, PCBs repair of any complexity.

Drying ovens

Drying ovens are for drying of fluid, hard and granular materials, which need heat treating.

Dry storage cabinets

Dry storage cabinets are safeguard for the components and electrical performance of the dielectrics while drying their inner environment according to the electronic production storage requirements. IP55 guaranties environmental dust and moister protection complying international standards.

Among many electronic manufacturers there is much tension around the issue where to buy SMD equipment. There is a wide choice of foreign manufactured SMT equipment for the prospective buyer and only Dial-Company offers a top-qualified SMT equipment of Russian manufacturers. It’s a great advantage of buying Russian manufactured machines at the most favorable price and 24-h/7-day service.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [~SEARCHABLE_CONTENT] => SMT EQUIPMENT DIAL-COMPANY [ /EN/ ] IS A RUSSIAN SMT MANUFACTURER. OUR EQUIPMENT IS FOR DIFFERENT AIMS: FROM SURFACE MOUNT TO SHELF STORAGE OF PRODUCTS. WE HAVE DIFFERENT EQUIPMENTS FOR: STENCIL PRINTING [ /EN/EQUIPMENT/SCREEN-PRINTING/ ] , REFLOW SOLDERING [ /EN/EQUIPMENT/REFLOW-SOLDERING/ ] , PCBS’ TRANSPORTING [ /EN/EQUIPMENT/TRANSPORT-SYSTEMS/ ] , PCBS’ REPAIRING [ /EN/EQUIPMENT/REPAIR-CENTERS/ ] , PCBS’ STORAGE [ /EN/EQUIPMENT/DRY-STORAGE/ ] . STENCIL PRINTING SMT EQUIPMENT (MANUAL, SEMIAUTOMATIC AND AUTOMATIC) ARE FOR THE PROCESS OF DEPOSITING SOLDER PASTE ON THE PRINTED CIRCUIT BOARDS (PCBS) IN SMALL AND HIGH VOLUME MANUFACTURING. WIDE RANGE OF SOLUTIONS AND MANY SETTINGS MAKE OUR PRINTERS MULTI-PURPOSE; GUARANTYING PCBS PRODUCING OF ANY COMPLEXITY ACCORDING TO A CUSTOMER’S WILLING. REFLOW SOLDERING THE MAIN SMT EQUIPMENT FOR REFLOW SOLDERING IS A REFLOW OVEN “ETNA”. IT HAS CONVEYOR SYSTEM, TRANSPORTING PCBS BETWEEN THE THERMAL ZONES. THE DEFINITE NUMBER OF EACH OF THE ZONES (PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING), THE SYSTEM OF ESTABLISHMENT OF INERT ATMOSPHERE WHILE SOLDERING, THE TYPE OF CONVEYOR (WIRE-BELT, CHAIN OR MIXED) HELP TO CHOOSE AN OVEN EVEN FOR SPECIFIC PRODUCTS. TRANSPORT EQUIPMENT THERE ARE 2 TYPES OF SMT TRANSPORT EQUIPMENT: CONVEYOR SYSTEMS AND PCBS LOADERS/UNLOADERS. THE MAIN AIM IS TO LOAD THE PCB’S INTO THE PRODUCTION LINE, TRANSPORTING THEM BETWEEN OTHER EQUIPMENT IN THE LINE, UNLOAD AND PUSHING PCBS INTO THE MAGAZINE RACKS. AT THE TIME OF ORDER A CUSTOMER CAN ADJUST THE WIDTH AND THE LENGTH OF THE CONVEYOR SYSTEM. LOADERS AND UNLOADERS PROVIDE A DESIRED AUTOMATION LEVEL FOR HIGH VOLUME MANUFACTURING. AUTOMATIC SERVICE STATIONS THE MAIN AIM OF THIS EQUIPMENT IS OPERATING WITH ELECTRONIC SMD ELEMENTS ON THE PCBS: REMOVAL AND INSTALLATION OF ELECTRONIC COMPONENTS, PCBS REPAIR OF ANY COMPLEXITY. DRYING OVENS DRYING OVENS ARE FOR DRYING OF FLUID, HARD AND GRANULAR MATERIALS, WHICH NEED HEAT TREATING. DRY STORAGE CABINETS DRY STORAGE CABINETS ARE SAFEGUARD FOR THE COMPONENTS AND ELECTRICAL PERFORMANCE OF THE DIELECTRICS WHILE DRYING THEIR INNER ENVIRONMENT ACCORDING TO THE ELECTRONIC PRODUCTION STORAGE REQUIREMENTS. IP55 GUARANTIES ENVIRONMENTAL DUST AND MOISTER PROTECTION COMPLYING INTERNATIONAL STANDARDS. AMONG MANY ELECTRONIC MANUFACTURERS THERE IS MUCH TENSION AROUND THE ISSUE WHERE TO BUY SMD EQUIPMENT. THERE IS A WIDE CHOICE OF FOREIGN MANUFACTURED SMT EQUIPMENT FOR THE PROSPECTIVE BUYER AND ONLY DIAL-COMPANY OFFERS A TOP-QUALIFIED SMT EQUIPMENT OF RUSSIAN MANUFACTURERS. IT’S A GREAT ADVANTAGE OF BUYING RUSSIAN MANUFACTURED MACHINES AT THE MOST FAVORABLE PRICE AND 24-H/7-DAY SERVICE. [CODE] => equipment [~CODE] => equipment [XML_ID] => [~XML_ID] => [TMP_ID] => [~TMP_ID] => [DETAIL_PICTURE] => [~DETAIL_PICTURE] => [SOCNET_GROUP_ID] => [~SOCNET_GROUP_ID] => [LIST_PAGE_URL] => [~LIST_PAGE_URL] => [SECTION_PAGE_URL] => /en/equipment/ [~SECTION_PAGE_URL] => /en/equipment/ [IBLOCK_TYPE_ID] => catalog [~IBLOCK_TYPE_ID] => catalog [IBLOCK_CODE] => equipment-en [~IBLOCK_CODE] => equipment-en [IBLOCK_EXTERNAL_ID] => [~IBLOCK_EXTERNAL_ID] => [EXTERNAL_ID] => [~EXTERNAL_ID] => [IPROPERTY_VALUES] => Array ( ) ) [1] => Array ( [ID] => 287 [~ID] => 287 [TIMESTAMP_X] => 2016-07-20 12:22:41 [~TIMESTAMP_X] => 2016-07-20 12:22:41 [MODIFIED_BY] => 1 [~MODIFIED_BY] => 1 [DATE_CREATE] => 2016-07-06 13:34:41 [~DATE_CREATE] => 2016-07-06 13:34:41 [CREATED_BY] => 1 [~CREATED_BY] => 1 [IBLOCK_ID] => 26 [~IBLOCK_ID] => 26 [IBLOCK_SECTION_ID] => 45 [~IBLOCK_SECTION_ID] => 45 [ACTIVE] => Y [~ACTIVE] => Y [GLOBAL_ACTIVE] => Y [~GLOBAL_ACTIVE] => Y [SORT] => 600 [~SORT] => 600 [NAME] => Reflow Soldering [~NAME] => Reflow Soldering [PICTURE] => [~PICTURE] => [LEFT_MARGIN] => 8 [~LEFT_MARGIN] => 8 [RIGHT_MARGIN] => 9 [~RIGHT_MARGIN] => 9 [DEPTH_LEVEL] => 2 [~DEPTH_LEVEL] => 2 [DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[~DESCRIPTION] =>

Reflow soldering is the most common method of attaching surface mount components to a circuit board. Reflow ovens from DIAL, what’re reliable, qualitative and time-tested, are ideal for this type of soldering.

A reflow oven is equipped with a transport system, consisting of chain, wire-belt and mixed conveyor. Every type of such conveyor is customized and has its own advantages. There are different communication interfaces on ovens, what helps to install an oven in one of the existing manufacturing line.

In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling.
- Preheat is the first stage of the reflow process (the number of heating module will be stated at order stage). The PCB must be heated in a consistent, linear manner. An important metric for the first phase of the reflow process is the temperature slope rate or rise vs time. Preheat eliminate risks of temperature shock and the damage of soldering units and circuit board. If the temperature slope rate moves gradually to 90-130 °C, volatile solvents outgas.
- Thermal soak. This zone is situated at the exit way of the preheat zone. The main processes are slowly temperature increase, the equalization of the temperature difference of the components, activation of the fluxes, and removal of solder paste volatiles. The temperature in this zone is about 150 – 170 °C.
- Reflow zone is the part of the process where the maximum temperature is reached. It is important to monitor the process temperature to keep it from exceeding this limit. Additionally, high temperatures (beyond 260 °C) may cause damage to the internal dies of SMT components as well as foster intermetallic growth.
- Cooling is the last zone. A fast cooling rate (to 130>°C ) is needed to create a fine grain structure. When the temperature is lower than 130°C, the cooling rate can be reduced.

All the zones can be individually controlled for:
- Preheat zone – for temperature;
- Thermal soak zone – for temperature;
- Reflow zone – for temperature;
- Cooling zone – for cooling-rate by traffic flow rate.

[DESCRIPTION_TYPE] => html [~DESCRIPTION_TYPE] => html [SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. [~SEARCHABLE_CONTENT] => REFLOW SOLDERING REFLOW SOLDERING IS THE MOST COMMON METHOD OF ATTACHING SURFACE MOUNT COMPONENTS TO A CIRCUIT BOARD. REFLOW OVENS FROM DIAL, WHAT’RE RELIABLE, QUALITATIVE AND TIME-TESTED, ARE IDEAL FOR THIS TYPE OF SOLDERING. A REFLOW OVEN IS EQUIPPED WITH A TRANSPORT SYSTEM, CONSISTING OF CHAIN, WIRE-BELT AND MIXED CONVEYOR. EVERY TYPE OF SUCH CONVEYOR IS CUSTOMIZED AND HAS ITS OWN ADVANTAGES. THERE ARE DIFFERENT COMMUNICATION INTERFACES ON OVENS, WHAT HELPS TO INSTALL AN OVEN IN ONE OF THE EXISTING MANUFACTURING LINE. IN THE CONVENTIONAL REFLOW SOLDERING PROCESS, THERE ARE USUALLY FOUR STAGES, CALLED "ZONES", EACH HAVING A DISTINCT THERMAL PROFILE: PREHEAT, THERMAL SOAK (OFTEN SHORTENED TO JUST SOAK), REFLOW, AND COOLING. - PREHEAT IS THE FIRST STAGE OF THE REFLOW PROCESS (THE NUMBER OF HEATING MODULE WILL BE STATED AT ORDER STAGE). THE PCB MUST BE HEATED IN A CONSISTENT, LINEAR MANNER. AN IMPORTANT METRIC FOR THE FIRST PHASE OF THE REFLOW PROCESS IS THE TEMPERATURE SLOPE RATE OR RISE VS TIME. PREHEAT ELIMINATE RISKS OF TEMPERATURE SHOCK AND THE DAMAGE OF SOLDERING UNITS AND CIRCUIT BOARD. IF THE TEMPERATURE SLOPE RATE MOVES GRADUALLY TO 90-130 °C, VOLATILE SOLVENTS OUTGAS. - THERMAL SOAK. THIS ZONE IS SITUATED AT THE EXIT WAY OF THE PREHEAT ZONE. THE MAIN PROCESSES ARE SLOWLY TEMPERATURE INCREASE, THE EQUALIZATION OF THE TEMPERATURE DIFFERENCE OF THE COMPONENTS, ACTIVATION OF THE FLUXES, AND REMOVAL OF SOLDER PASTE VOLATILES. THE TEMPERATURE IN THIS ZONE IS ABOUT 150 – 170 °C. - REFLOW ZONE IS THE PART OF THE PROCESS WHERE THE MAXIMUM TEMPERATURE IS REACHED. IT IS IMPORTANT TO MONITOR THE PROCESS TEMPERATURE TO KEEP IT FROM EXCEEDING THIS LIMIT. ADDITIONALLY, HIGH TEMPERATURES (BEYOND 260 °C) MAY CAUSE DAMAGE TO THE INTERNAL DIES OF SMT COMPONENTS AS WELL AS FOSTER INTERMETALLIC GROWTH. - COOLING IS THE LAST ZONE. A FAST COOLING RATE (TO 130>°C ) IS NEEDED TO CREATE A FINE GRAIN STRUCTURE. WHEN THE TEMPERATURE IS LOWER THAN 130°C, THE COOLING RATE CAN BE REDUCED. ALL THE ZONES CAN BE INDIVIDUALLY CONTROLLED FOR: - PREHEAT ZONE – FOR TEMPERATURE; - THERMAL SOAK ZONE – FOR TEMPERATURE; - REFLOW ZONE – FOR TEMPERATURE; - COOLING ZONE – FOR COOLING-RATE BY TRAFFIC FLOW RATE. 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This conveyor reflow oven is intended for the PCBs soldering in the air environment. The oven can be use as inline system or in stand alone mode. The soldering temperature in the process-camera and also other parameters are set by means of the operating computer. PCBs with the applied solder paste and the assembled components are transferred on the chain conveyor manually or move automatically from the previous device of the line. Moving on the conveyor, PCBs consistently pass through preheating zones, peak zones and a cooling zone. PCBs unloading from the oven's outlet is carried out manually or by transfer on the following device of the line. Thanks to active cooling system, temperature of unloaded PCBs is close to the room temperature.

The oven is equipped with eight heating zones (five preheating zones and three peak zones). Cooling zone consists of three active cooling sections. In all heating zones of heating hot air supplied the top and bottom sides. A special design of hot air supply system allows to provide the qualitative soldering of electronic components regardless of their bodies and dimensions. Besides, stability of soldering process is provided due to minimizing of mutual influence of heating zones.

Temperature profile control in the process camera is carried out by means of thermocouples, individually for each zone. Automatic control system allows to keep the preset profile with high precision. The profile is formed by independent temperature settings for each zone.

PCBs cooling after soldering process is carried out in active cooling zone. The cooled air is prepared by means of water cooling system with the built-in conditioner. The cooling system is equipped with replaceable filters for purification of air.

Oven is equipped with pin-chain conveyor. For heavy or flexible PCBs transportation the conveyor is equipped with central board support system (CBS). Width of the conveyor and CBS is set in the software and change automatically by means of electrical drives. Conveyor rails positions also can be changed manually. CBS rail can be moved to lowered position if there no necessity to use it.

Conveyor is equipped with automatic greasing system of conveyor and CBS chains. Frequency and duration of greasing are preset in software.

Digital regulator is providing stable conveyor speed regardless of time, temperature and quantity of loaded PCBs. Conveyor speed is set in softwarer in a wide range: from 180mm/min to 1800mm/min.

In the software there is function of visualization PCBs passing through process-camera. Besides, software indicates emergency situations e.g.: a PCB jam on inlet or outlet or PCB falling from conveyor chains.

Communication with previous and following devices of the line is carried out by means of the SMEMA interface. Delay between PCBs loading from the previous conveyor is programmable.

The oven's software allows to adjust various economy modes of the electrical power. For example, the maximum value of power consumption for each heating zone can be set individually. Settings of these values help to adjust balance between conveyor speed and energy consumption.

Automatic mode is provided by PC which supplied with the color graphic touchscreen monitor (22"). The software with the multimedia interface allows execute full control of the oven in simple and convenient way. Soldering profiles also created in the software. User interface language can be changed by the operator. Basic delivery includes support only Russian. At the request other languages can be installed.

All individual profile parameters can be saved under any name for future use. The quantity of the saved profiles is unlimited.

Dimensions and weight

Length

5000 mm

Width

1480 mm

Height

1740 mm

Weight

2550 kg

Floor load

400 kg/m2

Process-camera parameters

Length

4240 mm

Preheating zones quantity

5

Preheating zones length

1750 mm

Peak zones quantity

3

Peak zones length

1050

Max.temperature in the 1st zone

250°С

Max.temperature in preheating zones (except 1st)

300°С

Max.temperature in peak zones

350°С

Thermal system

Reflow

Gas circulation in heating zones

350 m3/h

Warm up time (soldering mode)

 about 30 min

Temperature profile accuracy

+/-2К

Cooling zone

Length

1050 mm

Sections quantity

3

Conveyor parameters

Conveyor width (adjustable)

70-430 mm

Conveyor type

Pin-chain 3 mm
(on demand 5 mm)

Top PCB side clearance

30 mm

Bottom PCB side clearance

14 mm

Conveyor speed

180-1800 mm/min

Speed deviation

≤ 18 mm/min

External environment

Ambient temperature

15-32°С

Humidity

30-75%

Electricity

Power supply

3х400 V +/-5% 50 Hz

Power cable

5 wires (3 phases, N, ground)

Start power consumption

Up to 54 kW

Work power consumption

10 kW

Adjustable central board supportThe option allows to transport big and thin PCBs without bending.

Automatic chain lubrication The option for automatic chains lubrication. Thanks to this system chains life time is increased significantly.

Conveyor speed controlСonveyor speed is adjustable and equipped with control system for constant monitoring.

Internal temperature monitoringEvery heating zone equipped with thermocouple for precise temperature measuring. Also there are thermocouples on the conveyor level.

SMEMA interfaceThe signal interface working under SMEMA protocol. The option is used for printer communication with the downstream line devices.

UPSThe option is necessary for power supply on PC, conveyor and cover of the process-chamber in the case of the main power breakage.

The user interface is based of modern technologies with use of the touchscreen monitor (a contact, dragging, scrolling, etc.);

Oven is equipped with built-in full alphanumeric keyboard, and also the separate digital keyboard for a direct input of the values; there is a specialized digital keyboard for input of complex values (temperature, the top and bottom tolerances); all features completely exclude need of use the ordinary keyboard and a mouse;

The program is based on one working field where all necessary information and control elements are displayed at the same time; it minimizes need of switching between various windows that finally accelerates and simplifies work of the operator;
Control elements are included in animated graphic blocks with grouped in a logical way information;
Animated monitoring and control system allows to see all processes running inside the oven;
For settings and display of the current profile two various methods are used; these methods are identical functionally, but differ in way of information allocation;
The first method is classical where the image of the internal device is shown with indications of the preset and actual temperatures; editing a profile is carried out by means of input of digital values in the corresponding fields;
The second method is a graphic where the preset and actual profiles are displayed in the form of schedules, i.e. in a look comfortable for the technologist; editing a profile on graphics is carried out by dragging of the schedule; it allows to form a profile as if "drawing" it on the screen; besides, the profile can be changed by means of special elements which additionally used as an indicators;
The database records all operations and also containing full information about the actual profile for each PCB which passed through an oven;
There is a possibility of automatic profile loading according to created schedule, the schedule is formed directly in the program; the schedule can be formed with single start (for a certain date and time) or with periodic start according to the schedule (on days of the week);
Profile loading can be carried out not only according to the name of a profile (file), but also via pushing graphic icon displayed at the file; this feature allows to choose profile more conveniently and quickly in the case when the list of these profiles becomes rather long;
The automatic screen blocking function helps to avoid casual change of a profile or oven's setup;
Various settings of the oven are carried out also by means of the graphic interface.