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  • Automatic stencil printer BURAN В102 / BURAN В102-S29

    Automatic stencil printer BURAN В102 / BURAN В102-S29

    This automatic printer was designed for solder paste apply on PCB surface. The printer is ideal solution for medium and high volume SMD-productions. BURAN can be used in two modes: as «inline» or «offline». For “inline” mode SMEMA interface is used.

    функция print
  • Semi-automatic stencil printer В70

    Semi-automatic stencil printer В70

    Semi-automatic printer B70 was designed for applying of solder paste, silicon and glue on PCBs and flexible substrates. This model provides high repeatability and precision of printing and mostly can be used on small and medium volume productions with often products changeovers. GUI of B70 software is simple and informative. Touch screen monitor (22'') allows to execute all operations very quickly.

    функция print
  • Semi-automatic stencil printer "Buran" B073

    Semi-automatic stencil printer "Buran" B073

    Semi-automatic stencil printer "Buran" B073 is designed for the application of solder paste on PCBs and has been designed primarily for experienced, small-scale and multiproduct manufacturing.

    функция print
  • Stencil printer «Grafi 03»

    Stencil printer «Grafi 03»

    Grafi 03 combines precision and efficiency.
    The basic characteristics of Grafi 03 – easy-to-use and user-friendly, fast rearragment of the production line and flexibility from start to finish.

    функция print
  • Pneumatic stencil tension frame

    Pneumatic stencil tension frame

    Pneumatic stencil tension frame is designed for the application of solder paste on printed circuit boards.

    функция print

DIAL-Company offers stencil printers “BURAN”. These machines (manual, semiautomatic and automatic) are for the process of depositing solder paste on the printed wiring boards (PWBs) in small and high volume manufacturing.

Automatic stencil printing

The process begins with loading the stencil into the printer. The pneumatic system of stencil tension from DIAL aligns the stencil to the substrate with accuracy. It helps to avoid an unequal application of the solder paste and prevent solder-balling when the paste is deposited beyond the edge of the board. Such situation can cause a short circuit or damage of the printed wiring boards.

Then the board is loaded into the conveyor. The loading arts can differ: manual or automatic. If it’s automatic, the board will be input from the previous machine. If it’s manual, a control engineer will do it in own hand. Loading and unloading side is controlled by a special program. Such opportunity lets use stencil printers for high-, medium- and small-volume manufacturing.

When the board has aligned the stencil, the solder paste is deposited by stainless steel blades (attack angle – 65°), that are easy-to-use under the small components and don’t “pull-out” the solder paste from apertures. Both blade pressure and print-head control guarantee high quality and equal application of the solder paste. When the pressure is correctly adjusted, the stencil will be clean.

The next step is PCB separation. Speed is chosen experimentally, it depends on components setting: the more is the setting, the more is the separation speed.

At the order of 2-D inspection for stencil printers from DIAL inspection system measures the amount of paste covering the board and verifies the stencil aperture cleanness.

Stencil printers are equipped with software SmartPrint. Touch-interface makes printer manipulating easier and easy-to-use.